A common task that is often dreaded among PCB designers is having to relocate a large point-count BGA that’s fanned out, and even partially escaped routed, to the opposite side of a PCB. This tech tip demonstrates how to embed routed patterns into components to make them easy to move and then mirror the components on the opposite sides of the design.
This is an exciting time in the product development world. Increasing product complexity is driving the need for a design process evolution. Not long ago the detailed design process was the centerpiece of product development. But the need for functional and physical design accuracy is forcing the product development process to evolve. In response, the product development process is both converging and expanding.
Advanced packaging techniques such as system-in-package (SiP), fan-out wafer-level packaging (FOWLP), 3D die stacks, etc. have been around for over a decade, yet with any other EDA design tool, it is still a tedious, time consuming, and error-prone process to implement these designs. It seems surprising that there are so few reliable EDA solutions out there, but CR-8000 Design Force is definitely the tool to look to when tackling advanced package design! Take a look below and see why.
One of the more powerful capabilities of a good Data Management system such as DS-2 is searching and the ability to generate reports. A great example is the ability to generate Where-used information. These types of reports are extremely useful when performing impact assessments.
As we witness the birth of an era of connected devices with smart homes, connected cars and smart networked supply chains and factories, we might imagine that unexpected failures of electronic products would be a rarity. But all too often we hear about cellphones going up in flames, airbags that deploy on their own, or drones falling out of the sky. It is estimated that in the automotive industry alone, global warranties amount to as much as USD 40 billion per year.