A Swiss colleague recently mentioned to me that many of his customers in the machinery and industrial equipment industry are burdened by the longevity of their products. Some were designed and manufactured so well that many customers saw no need for replacement – even after decades of service. An interesting aspect!
As a boating enthusiast, I appreciate the beauty of an older mahogany run-about, the finely painted details of a sailboat and the flash and bling of a high performance off-shore go-fast gas guzzler. And let’s not forget the indulgence of a mega yacht that many of us dream of boarding for a gathering for a few hours for some serious dream building and mingling.
As the year winds down, we invite you to check out our most viewed webinars of 2017. The Technical Webinar Series is a blend of forward looking topics like Model Based Systems Engineering and every day design challenges. We hope you find the webinar format useful and engaging.
How Virtual Prototyping Tools Can Help Decide if Fan-out Wafer-level Packaging is Right For Your Product
Since it contributed to making the iPhone7 even thinner than its predecessors, fan-out wafer-level packaging (FO-WLP) technology has risen in the collective consciousness. By adopting FO-WLP on this scale, Apple sent out a signal that though highly novel, the technology had matured.
The traditional PCB-centric design process is being replaced by a system-centric process. The system can be defined as the final product (e.g., camera) or one of the many components that comprise a product (e.g., 1 of 80 electronic control units in a car). Product complexity is driving this profound shift away from a focus on detailed design toward a systems engineering approach.