There’s no doubt that board systems are getting more complex. System-level engineering can help mitigate those risks. One of the main advantages is developing and comparing systems architectures, which provides visibility into the constraints of design decisions to engineers, helping them to avoid nasty surprises late in development.
Modular board design coupled with predictive analysis results gathered from the Internet of Things keeps product costs low and increases flexibility and customization options.
Using feedback from products in the field to continuously improve design modules used as the basis for product development can increase product performance and reliability and reduce development time.
Please join us for our Fall/Winter Webinar Series that will run from September through March 2019. Over the following months, we’ll be covering a wide range of topics, from Silicon Expert to E3.series MCAD co-design. During each webinar, we’ll cover a common design challenge and present/demonstrate a solution. You’ll leave with takeaways that you can immediately apply to your daily activities.
We’re happy to announce that Speedstack, Polar Instruments’ layer stackup design/documentation tools, can now be directly linked to Zuken’s CR-8000 Design Force and DFM Center.
