Many of the major players in the automotive industry are going full throttle towards autonomous vehicles. But when are we likely to see these vehicles upscale and become a mass consumer item? It’s a hotly debated question.
The 5 Top Design Issues: ECAD/MCAD Integration, PLM Integration, Data Management, Augmented Reality and PCB Package Co-Design
At this year’s annual conferences (ZIW) across Europe we brought together leading companies in their fields to discuss some of the design community’s the latest electrical and electronic design issues including: ECAD/MCAD integration, PLM integration, augmented reality and PCB package co-design.
If you haven’t got your local European ZIW conference in your diary for 2017, then you might just want to.
In the electronics and electrical engineering design communities there is plenty of talk about IoT, particularly in relation to the opportunities, but arguably the more pressing issue right now is the need to design for security in the connected world.
Last month I visited Poland’s major defense show, MSPO, for the first time. Because I’d visited DSEI in London last year I was familiar with the military grandeur that you only experience at one of these big defense industry events. But the difference at MSPO is that although it’s huge and the general investment in the show is visible, it’s much more hands-on. The event has grown in its 24 years to become the third largest defense show in Europe.