UCLA CHIPS has pioneered the concept of small dielet integration directly on a Silicon-based interconnect fabric (Si IF) or a flexible Fan-out wafer-level Package.
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The embarrassment of choice has become a powerful sales instrument – not only in the consumer market, where an abundance of sizes, colors, styles and flavors tempts the buyer to load more items into their shopping cart than they have on their shopping list.
It is also a powerful differentiator the investment goods industry. Bespoke products that are customized to meet a customer’s business needs are an important driver for companies that operate at the high end of their respective markets, such as automation, industrial machinery and transportation.
More often than not, our customers are less interested in the core functionality of the software than the goals and objectives they need to achieve when using it. These are usually product development projects with deadlines, cost and performance targets, alongside project management and coordination efforts. So, success for our customers is only achieved if the tools are deployed in a way that supports the company’s product development process and its related requirements.
As we witness the birth of an era of connected devices with smart homes, connected cars and smart networked supply chains and factories, we might imagine that unexpected failures of electronic products would be a rarity. But all too often we hear about cellphones going up in flames, airbags that deploy on their own, or drones falling out of the sky. It is estimated that in the automotive industry alone, global warranties amount to as much as USD 40 billion per year.