Since it contributed to making the iPhone7 even thinner than its predecessors, fan-out wafer-level packaging (FO-WLP) technology has risen in the collective consciousness. By adopting FO-WLP on this scale, Apple sent out a signal that though highly novel, the technology had matured.
Modern PCB designs have IOs reaching speeds of multi Gigabits per second, making signal integrity analysis an imperative for any product in the design phase. As the industry spends increasing amounts of time on finding and fixing these issues, it’s worthwhile any designers out there that are not already doing so, investing some energy in reducing design cycle time through early identification of high speed issues like crosstalk and return path discontinuity etc.
