We’re happy to announce that Speedstack, Polar Instruments’ layer stackup design/documentation tools, can now be directly linked to Zuken’s CR-8000 Design Force and DFM Center.
We had a record-breaking Zuken Innovation World Americas this year, and we’re planning to outdo ourselves in 2019. We’re now accepting abstracts for ZIW 2019, which will be held in Hilton Head, South Carolina from April 15-17. The event includes a two-day conference and one-day exhibition at the Hilton Head Marriott Resort & Spa.
The silicon brains of today’s warfighters are just as complex as their alloy exteriors, requiring engineers like those at Lockheed Martin to have mastery of not only aeronautics and flight, but also advanced computing and electronics.
Zuken Innovation World Americas 2018 took place recently in San Diego and was record-setting! This was by far the largest ZIW event held in the Americas based on registrations, partners and international visitor attendance. Customer participation also set a record with over 25% of the sessions being delivered by customers. But, breaking records is only part of the story.
Flex designs pose unique challenges for most PCB tools because traditional object checks don’t account for Flex checks nuances. They present a new set of objects that are best accounted for during the design phase.
This forces designers to incorporate changes after the design data is off to manufacturing for build. The manufacturer must then perform the Flex-based checks on the design and relay the issues back to the designer. This leads to a frustrating loop that delays product releases and wastes money.
