All of you PCB designers out there – I hope you had the opportunity to attend PCB West this year. The sold-out show floor was all abuzz with activity, as was our booth and the Zuken-sponsored barista cart. Free latte or cappuccino – who can pass on that?
The proliferation of packaging designs that combine multiple chips into a single package is creating new challenges for package, printed circuit board (PCB) and integrated circuits (IC) designers. The common practice of designing the package, PCB and IC in st and- alone environment s requires time – consuming manual processes that are error-prone and limit the potential for design reuse. What is needed are 3D co-design tools that integrate planning and final design implementation at the system level for PCBs, ICs, packages and mechanical enclosures.
Harness Builder 2018 for E3.series is packed with new features and customer-driven enhancements with a focus on the manufacturing side of the process with the addition of new direct driving exports and documentation. New enhancements include an innovative way to display the wires on front or back images of connectors and within the tables located next to connectors on the formboard drawings. This assists the assembler with visualizing which colored wires go into the designated connector cavities and can greatly increase harness build speed while limiting errors.
We’re happy to announce that Speedstack, Polar Instruments’ layer stackup design/documentation tools, can now be directly linked to Zuken’s CR-8000 Design Force and DFM Center.
We had a record-breaking Zuken Innovation World Americas this year, and we’re planning to outdo ourselves in 2019. We’re now accepting abstracts for ZIW 2019, which will be held in Hilton Head, South Carolina from April 15-17. The event includes a two-day conference and one-day exhibition at the Hilton Head Marriott Resort & Spa.