As we witness the birth of an era of connected devices with smart homes, connected cars and smart networked supply chains and factories, we might imagine that unexpected failures of electronic products would be a rarity. But all too often we hear about cellphones going up in flames, airbags that deploy on their own, or drones falling out of the sky. It is estimated that in the automotive industry alone, global warranties amount to as much as USD 40 billion per year.
Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phone came around, they learned that they needed to shrink the board from 8mm x 8mm to 4.5mm x 6mm, and they had to shrink the module thickness from 1.7mm to 1.0mm. The original design was a simple board with a wire bond package and several peripherals. Competitive pressures required a significant reduction in size and thickness.
The only thing I like more than a good win-win situation is when there’s a win-win-win. That was the conclusion I drew when I discovered how Pantec Automation, which designs and manufactures control systems for machines, used E3.series to almost halve its manufacturing times.
When Renishaw decided to migrate to Zuken’s latest PCB design suite in 2016, a main driver was the suite’s capabilities for designing and analysing their next-generation flexible PCBs.
French company Techno MAP joins recent members M-Sport, HCI Systems, Teepee Electrical and others who have adopted E3.series based on peer recommendations about the tool’s flexibility, ease of adoption and increased productivity.