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Toshiba Embedded Module

Toshiba – RF Module Shrink (TransferJet™)

Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phone came around, they learned that they needed to shrink the board from 8mm x 8mm to 4.5mm x 6mm, and they had to shrink the module thickness from 1.7mm to 1.0mm. The original design was a simple board with a wire bond package and several peripherals. Competitive pressures required a significant reduction in size and thickness.