Have you ever finished generating the manufacturing release package for the latest product design and then it occurred to you that something may be wrong?
Each year, Zuken Innovation World (ZIW) brings together members of the Zuken community to share knowledge and experiences that drive learning and innovation. We’ve issued the call for papers for the April 2018 event in San Diego, and now we want to hear from you.
The 5 Top Design Issues: ECAD/MCAD Integration, PLM Integration, Data Management, Augmented Reality and PCB Package Co-Design
At this year’s annual conferences (ZIW) across Europe we brought together leading companies in their fields to discuss some of the design community’s the latest electrical and electronic design issues including: ECAD/MCAD integration, PLM integration, augmented reality and PCB package co-design.
Content, content, content, that’s what the 2017 agenda was all about.
We all know that manufacturing yields and costs are the driving force behind product development, rather than product quality.