On June 6th, the Italian Zuken Community met in Bologna at Zuken Innovation World 2019 Italy.
Laying out high-speed buses has become a truly joined-up science, with both PCB and IC designers on the team.
UCLA CHIPS has pioneered the concept of small dielet integration directly on a Silicon-based interconnect fabric (Si IF) or a flexible Fan-out wafer-level Package.
Would you consider traveling to Germany to visit a tradeshow? Read on to see why you should, and learn more about this once-in-a-lifetime opportunity to visit Zuken at Hannover Messe.
In part 1 of this blog we took a back-to-basics approach and discussed line impedance and its effects in signal integrity. As every electrical conductor comprises capacitance, an inductance, and a frequency-dependent ohmic resistance, and...