Each year, Zuken Innovation World (ZIW) brings together members of the Zuken community to share knowledge and experiences that drive learning and innovation. We’ve issued the call for papers for the April 2018 event in San Diego, and now we want to hear from you.
The 5 Top Design Issues: ECAD/MCAD Integration, PLM Integration, Data Management, Augmented Reality and PCB Package Co-Design
At this year’s annual conferences (ZIW) across Europe we brought together leading companies in their fields to discuss some of the design community’s the latest electrical and electronic design issues including: ECAD/MCAD integration, PLM integration, augmented reality and PCB package co-design.
Content, content, content, that’s what the 2017 agenda was all about.
If you haven’t got your local European ZIW conference in your diary for 2017, then you might just want to.
A few weeks ago I was at DesignCon 2017, with the other 3999 people that registered for this annual event; learning about the latest hot topics being talked about in the industry, which included modelling and analysis of high-speed digital circuitry, the latest fast memory architectures such as GDDR5, DDR5 and DDR6, power distribution and power integrity, plus wider engineering issues such as IoT and eLearning.