Top 5 Design Issues

The 5 Top Design Issues: ECAD/MCAD Integration, PLM Integration, Data Management, Augmented Reality and PCB Package Co-Design

At this year’s annual conferences (ZIW) across Europe we brought together leading companies in their fields to discuss some of the design community’s the latest electrical and electronic design issues including: ECAD/MCAD integration, PLM integration, augmented reality and PCB package co-design.

DesignCon 2017

DesignCon 2017: What’s Hot on the Electronics and Engineering Agenda

A few weeks ago I was at DesignCon 2017, with the other 3999 people that registered for this annual event; learning about the latest hot topics being talked about in the industry, which included modelling and analysis of high-speed digital circuitry, the latest fast memory architectures such as GDDR5, DDR5 and DDR6, power distribution and power integrity, plus wider engineering issues such as IoT and eLearning.