The blockchain is one of today’s most polarizing technological innovations. Basically, it is an immutable public record designed to enable parties who don’t necessarily trust each other to safely interact and transact without having to give up control to or pay rents to a third-party such as a traditional bank, social network or online marketplace. The world was introduced to blockchain technology by the success of the Bitcoin cryptocurrency, which uses the blockchain to enable the currency to be transferred between parties without an intermediary.
As we witness the birth of an era of connected devices with smart homes, connected cars and smart networked supply chains and factories, we might imagine that unexpected failures of electronic products would be a rarity. But all too often we hear about cellphones going up in flames, airbags that deploy on their own, or drones falling out of the sky. It is estimated that in the automotive industry alone, global warranties amount to as much as USD 40 billion per year.
How Virtual Prototyping Tools Can Help Decide if Fan-out Wafer-level Packaging is Right For Your Product
Since it contributed to making the iPhone7 even thinner than its predecessors, fan-out wafer-level packaging (FO-WLP) technology has risen in the collective consciousness. By adopting FO-WLP on this scale, Apple sent out a signal that though highly novel, the technology had matured.
Imagine if you could gather product performance information while your product is being used by the customer.
The basic detailed design to manufacturing process isn’t cutting it. So while detailed design is converging, the design process is expanding.