Content, content, content, that’s what the 2017 agenda was all about.
We all know that manufacturing yields and costs are the driving force behind product development, rather than product quality.
The good news is that more and more devices are becoming part of the Internet of Things (IoT), which extends the design team’s visibility beyond manufacturing – and that changes everything.
With key functionality in many cases commoditized, the success or failure of wearables is increasingly determined in the early stages of the PCB and mechanical integration process where requirements are translated into practical design decisions such as how functions are mapped to PCBs and PCBs are integrated into the enclosure.
A few weeks ago I was at DesignCon 2017, with the other 3999 people that registered for this annual event; learning about the latest hot topics being talked about in the industry, which included modelling and analysis of high-speed digital circuitry, the latest fast memory architectures such as GDDR5, DDR5 and DDR6, power distribution and power integrity, plus wider engineering issues such as IoT and eLearning.