Electronic components are constantly changing, causing parts to go EOL (End-of-Life) for various reasons: companies go out of business, component product lines change hands, old technology is updated with new. Electronic product manufacturers must be agile to keep their product BOMs (bill of materials) up to date and keep their supply chain humming. Fortunately for them, Zuken’s DS-CR customers leverage component and design data relationships to tackle the problem.
When it comes design rule checks for PCB designs, there are checks that should be performed that are just as important as spacing rules. Strict adherence to basic PCB design rule checks, such as track to track, track to via, via to via, pad to track etc. – though necessary to avoid short circuits – only scratch the surface when trying to identify potential design flaws. I often see PCB designs that are completed based on this premise and wonder what else could be hiding in the design?
Design Force 2017 has improved the offset via function by adding efficiency in pulling out tracks from vias, creating BGA designs and build-up designs. The controls are based on the following: Qualified padstacks, rule-based layer pair vias, and parameters specified in teh offset via command panel.
A common task that is often dreaded among PCB designers is having to relocate a large point-count BGA that’s fanned out, and even partially escaped routed, to the opposite side of a PCB. This tech tip demonstrates how to embed routed patterns into components to make them easy to move and then mirror the components on the opposite sides of the design.
This is an exciting time in the product development world. Increasing product complexity is driving the need for a design process evolution. Not long ago the detailed design process was the centerpiece of product development. But the need for functional and physical design accuracy is forcing the product development process to evolve. In response, the product development process is both converging and expanding.