Connect CR-8000 with Polar Instruments’ Speedstack PCB Stackup/ECAD Interface
Design Force users can now exchange pre-layout designs seamlessly thanks to Polar’s Speedstack for IC packaging and PCB design. CR-8000 DFM Center can validate the stackup before it’s released to manufacturing.
The link also empowers designers to:
- Simplify material communication during the supply chain
- Preserve signal integrity design accuracy throughout product development
- Avoid material and impedance duplication
- Access high-speed materials online
The interface relays comprehensive material information required for complex designs with high layer counts. Zuken customers can also access Polar’s expansive online library of high-speed base materials. Impedance information within the Speedstack is loaded into CR-8000’s environment; no tedious and error-prone manual entry is required.
For more information, read Polar and Zuken’s official announcement.