Improve quality

Improve your PCB Quality and Cost with Concurrent Power Integrity Analysis

I don’t always make it to all the tradeshows during the year, but I was lucky to attend PCB West in Santa Clara earlier this year where I had an opportunity to do a presentation on Power Integrity analysis that my colleague Ralf Bruening and I put together, and how it can save time and cost by doing this analysis concurrently with the board layout.

Along with the nice weather and great cuisine, the conference turn-out was amazing. It was good to see the variety of individuals and disciplines present at the conference. We had many visitors attend our booth, and most of the attendees were excited with our Blackberry Playbook giveaway.

Presentation now available

I received lots of requests for the presentation paper, so I’m happy to say it is now available via SlideShare – see below, or you can download it here from SlideShare.

In summary, the presentation looks at the increasing challenges with power distribution systems on modern high-speed PCBs and considers…

  • IC input impedance behavior
  • Resonance behavior of power distribution systems (PDS)
  • Management of decoupling capacitors
  • EDA methodology for concurrent power integrity simulation throughout PCB design process

Other PCB West highlights

As well as presenting our paper we were also supporting the IPC-2581 booth, which also received a great deal of attention – and eventually led to a great dialog during the panel discussion later that day on data transfer for manufacturing. You can refer to a previous post as to why we believe IPC-2581 is so important.

Plus, let’s not forget that PCB West was also the debut of our first CR-8000 release this year, CR-8000.

It was a busy PCB West 2011! We have already signed up for 2012, so perhaps we will see you in Santa Clara next year (September 25-27 2012)

In the meantime, if you have any comments or questions, please leave them below.

Written by

Humair Mandavia is the chief strategy officer at Zuken, responsible for the SOZO Center, Zuken’s US R&D division in Silicon Valley. His responsibilities include working with industry-leading companies in the automotive, IoT, and other key technology sectors to help drive the latest innovations in electronic design to the market. A member of the Zuken team since 2004, his past roles include solutions architect, product manager, and director of engineering. Professional experience includes working as hardware design engineer at ADC Telecommunications designing ATM and SONET applications. Mandavia received his bachelor of science in electrical engineering and his MBA from the University of Texas at Dallas, and is a current board member for Si2.

You may also like...