Las Vegas

What happens in Vegas doesn’t have to stay in Vegas….IPC APEX 2014

What’s not to love about Vegas? Whether you’re here for the food or to enjoy shows and events, Las Vegas also makes for an exciting place for an industry conference. IPC APEX 2014 was held this year in Las Vegas, and Zuken was there among thousands of industry professionals from more than 50 countries. And like previous years, it was a very good show. There were many tracks and sessions on important industry topics and standards.

Steve Watt and I were given the opportunity to present two papers this year. Our first paper was “Enabling I/O Optimization with 3D SoC, SiP, and PCB co-design”. We discussed about a system-level approach on 2.5/3DIC, system-in-package (SiP), and board design in a unified collaborative approach. We also explored how you can optimize IOs, along with data exchange. Zuken is already working with JEITA and IEEE to standardize the LBP format for system-level design, and now we want to extend our efforts with IPC for design data exchange for this area.

The second paper was on “Implementing Embedded Components from Concept-to-Manufacturing”. We explored the trends in the market with the use of embedded components, and how standards, including the efforts of IPC, have helped the adoption of embedded components across all industries. During the session we also discussed how active components are now being used for embedding, and the challenges and trade-offs to consider. Plus, why working with embedded components is a 3D problem, and how your 3D-based approach should be used, from planning to designing your products with this type of technology.

The IPC-2581 Consortium also had a booth this year and Zuken was in attendance at the exhibit to show their support of an open industry standard for data exchange for fabrication, assembly, test and more. The turnout was great and we are continuing to help garner more corporate and individual support for this standard.  Visit for news, updates, and details on how to join the Consortium.

On behalf of Zuken’s contribution to the IPC-2581 consortium, Steve and I were both awarded plaques at the IPC Award Luncheon. We are sincerely honored with the award, and plan to continue to help accelerate the adoption of the standard.

Contrary to the saying, “What happens in Vegas, stays in Vegas,” we’d disagree. By  attending IPC APEX, we’ve been able to take away a great deal from our experiences and hope others have been able to as well.

Missed the show? – join our webinar

Steve Watt will be presenting his session on I/O Optimization with 3D SoC, SiP, and PCB co-design in May.

Written by

Humair Mandavia is the chief strategy officer at Zuken, responsible for the SOZO Center, Zuken’s US R&D division in Silicon Valley. His responsibilities include working with industry-leading companies in the automotive, IoT, and other key technology sectors to help drive the latest innovations in electronic design to the market. A member of the Zuken team since 2004, his past roles include solutions architect, product manager, and director of engineering. Professional experience includes working as hardware design engineer at ADC Telecommunications designing ATM and SONET applications. Mandavia received his bachelor of science in electrical engineering and his MBA from the University of Texas at Dallas, and is a current board member for Si2.