Advanced packaging techniques such as system-in-package (SiP), fan-out wafer-level packaging (FOWLP), 3D die stacks, etc. have been around for over a decade, yet with any other EDA design tool, it is still a tedious, time consuming, and error-prone process to implement these designs. It seems surprising that there are so few reliable EDA solutions out there, but CR-8000 Design Force is definitely the tool to look to when tackling advanced package design! Take a look below and see why.
One of the more powerful capabilities of a good Data Management system such as DS-2 is searching and the ability to generate reports. A great example is the ability to generate Where-used information. These types of reports are extremely useful when performing impact assessments.
As we witness the birth of an era of connected devices with smart homes, connected cars and smart networked supply chains and factories, we might imagine that unexpected failures of electronic products would be a rarity. But all too often we hear about cellphones going up in flames, airbags that deploy on their own, or drones falling out of the sky. It is estimated that in the automotive industry alone, global warranties amount to as much as USD 40 billion per year.
The customization and workspace flexibility is one more way for E3.series to give the user what they need and want. All workspace customizations can be saved locally to provide a consistent user interface.
We are all looking to gain productivity in our design cycle to save time and reduce costs. A good method to get a head start is to use Excel or a .csv file to get the design started and load devices into you project.
The most common application is to load the connectors and signals from Printed Circuit Board (PCB) in the electrical design. Blocks can be used to represent systems and the Excel sheet can help you get the system information from other teams or 3rd party vendors.