Featured. PCB, Electrical and Design Data Management.

Advanced Chip Package Board Codesign

Advanced Chip-Package-Board Co-design

The proliferation of packaging designs that combine multiple chips into a single package is creating new challenges for package, printed circuit board (PCB) and integrated circuits (IC) designers. The common practice of designing the package, PCB and IC in st and- alone environment s requires time – consuming manual processes that are error-prone and limit the potential for design reuse. What is needed are 3D co-design tools that integrate planning and final design implementation at the system level for PCBs, ICs, packages and mechanical enclosures.

Metal Additive Electronics Cooling

Metal Additive Helps Overcome Tough Electronics Cooling Challenge

Man-carried military communication systems often consume large amounts of power. The heat must be removed from the electronics package to avoid frying sensitive electronic components. The package typically is designed to be carried in a backpack which often puts difficult constraints on the form factor and weight of the system.

Electrical panel

Tech Tip: Creating Cable Ducts and/or Wire Combs in the E3.series Database

Cable ducts are special devices used in E3.panel that can be created with or without a definition in an E3.series database. These cable ducts can be created and placed on panel sheets; they’re used to route wires from one location to another. They can also be used with automatic routing functionality so the wires are routed from start to finish using the shortest path, which would be defined by the cable duct.