This video will show step by step instructions on how to create a basic Panel Model and insert a 3D STEP file.
A new generation of 3D multi-board product-level design tools manages multi-board placement in both 2D and 3D and enables co-design of the chip, package and board in a single environment. Multi-board design makes it possible to create and validate a design with any combination of system-on-chips (SoC), packages and PCBs as a complete system. Chip-package-board co-design enables designers to optimize routability via pin assignment, and I/O placement to minimize layer counts between the package, chip and board. The new design methodology makes it possible to deliver more functional, higher performing and less expensive products to market in less time.
PCB design tools were built on 2D software methods in the 1980s. Many of today’s design tools still use that 2D code base. Mechanical tools have moved on to native 3D design. PCB has...
We’re happy to announce that Speedstack, Polar Instruments’ layer stackup design/documentation tools, can now be directly linked to Zuken’s CR-8000 Design Force and DFM Center.
We live in a 3D world (OK, four if you count time). Over a decade ago 3D made a comeback in cinemas. And in the world of engineering, most mechanical design engineers have worked in 3D for decades. But it’s only relatively recently that electrical/electronic engineers have been able to fully join the 3D world – and wow, what a difference it’s made!
This is an exciting time in the product development world. Increasing product complexity is driving the need for a design process evolution. Not long ago the detailed design process was the centerpiece of product development. But the need for functional and physical design accuracy is forcing the product development process to evolve. In response, the product development process is both converging and expanding.