As IC packaging architecture advances, Zuken’s Design Force enables the designer to deal with the growing complexity in design space in handling high pin-counts, high density designs and the need to interface with multiple formats and flows.
Advanced Chip-Package-Board Co-design
The proliferation of packaging designs that combine multiple chips into a single package is creating new challenges for package, printed circuit board (PCB) and integrated circuits (IC) designers. The common practice of designing the package, PCB and IC in st and- alone environment s requires time – consuming manual processes that are error-prone and limit the potential for design reuse. What is needed are 3D co-design tools that integrate planning and final design implementation at the system level for PCBs, ICs, packages and mechanical enclosures.
