Advanced packaging techniques such as system-in-package (SiP), fan-out wafer-level packaging (FOWLP), 3D die stacks, etc. have been around for over a decade, yet with any other EDA design tool, it is still a tedious, time consuming, and error-prone process to implement these designs. It seems surprising that there are so few reliable EDA solutions out there, but CR-8000 Design Force is definitely the tool to look to when tackling advanced package design! Take a look below and see why.
Market driven engineering decisions require system co-design at a fast pace. Also, modern design flows incorporate a lot of design reuse necessitated by the fast pace of the market as well as efficient use of engineering resources. Zuken supports this important aspect through both a bottom-up and a top-down, wherein the user has the ability to drive decisions starting either from the chip to the board or the from the board on to the chip. This solution does away with file-hand-offs and the need to move between different tools, thus making for a seamless flow to optimize the bump- and ball- maps offering a true co-design experience.