3D Multi-board Product-Level PCB and IC Packaging Design

A new generation of 3D multi-board product-level design tools manages multi-board placement in both 2D and 3D and enables co-design of the chip, package and board in a single environment. Multi-board design makes it possible to create and validate a design with any combination of system-on-chips (SoC), packages and PCBs as a complete system. Chip-package-board co-design enables designers to optimize routability via pin assignment, and I/O placement to minimize layer counts between the package, chip and board. The new design methodology makes it possible to deliver more functional, higher performing and less expensive products to market in less time.