Tagged: Thermal Analysis

Thermal AnalysisThermal issues have long been one of the many Achilles heels in electronics design, in much the same way that electromagnetic noise and interference messes with your board.

 

 

Toshiba Embedded Module

Toshiba – RF Module Shrink (TransferJet™)

Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phone came around, they learned that they needed to shrink the board from 8mm x 8mm to 4.5mm x 6mm, and they had to shrink the module thickness from 1.7mm to 1.0mm. The original design was a simple board with a wire bond package and several peripherals. Competitive pressures required a significant reduction in size and thickness.

Reduce Thermal Analysis Time Early on in the Design Process with Chip-Package-Board Co-design

Thermal issues have long been one of the many Achilles heels in electronics design, in much the same way that electromagnetic noise and interference messes with your board. My blog post looks at how thermal dissipation is growing to be a much bigger beast than ever before as semiconductor companies and OSATs strive to better their products in the battle against time-to-market and better performance by stacking integrated circuits (ICs) in a package. Then I’ll be taking a look at how you can overcome thermal issues using new methodology through bringing the package, chip and board design environments together.